Description:
1. ESP32-S3 is a low-power MCU system level chip (SoC) that integrates 2.4 GHz Wi Fi and low-power bluetooth LE dual-mode wireless communication.
2. ESP32-S3 has a complete Wi Fi subsystem and a low-power bluetooth subsystem, with industry-leading low-power and RF performance. Supports multiple low-power working states and can meet the power consumption requirements of various application scenarios. The ESP32-S3 chip provides rich peripheral interfaces and multiple unique hardware security mechanisms. A comprehensive security mechanism enables the chip to meet strict security requirements.

Specifications:
1. Core: Xtensa @ dual core 32 bit LX7 CPU, frequency up to
240MHz
2. Memories:384 KB of ROM512 KB of SRAM16 KB of RTCSRAM. 8 MB of PSRAM
3. Working Voltage: 3 V to 3.6 vUp to 45 GPIOs
12-bit ADC (up to 20 channels) Communication interfaces
12c interfaces
12s interface
SPI interfaces 3 UART interfaces
USB OTG interface Security:
4096 bit OTP
AES, SHA, RSA, ECC, RNG
Secure Boot, Flash Encryption, Digital Signature, HMAC Module
Extended temperature range: -40 to 65 ° C

Package Include:

(optional)

u3010Only Boardu3011:

1x ESP32-S3 CAM Development Board

u3010Board+OV2640 Camerau3011:

1x ESP32-S3 CAM Development Board

1x OV2640 Camera

u3010Board+OV2640 Camera+Burner Socketu3011:

1x ESP32-S3 CAM Development Board

1x OV2640 Camera

1x Burner Socket